国家/地区 美国（2）
IPC部 B（2）
IPC大类 B01（2）
IPC小类 B01D（2）
IPC C01B031/04（2）
发明人
公开年 2014（2）
申请年
专利权人

Separating a composite sheet including atomically thin material i.e. graphene and substrate i.e. copper, comprises applying hypersonic waves to the sheet so as to separate the thin material from the substrate.

STETSON J B, VISS S J

Repairing graphene, comprises applying first and second reactive material to first and second sides of the graphene layer, and reacting the reactive materials in the hole to produce a plug in the hole and to repair the graphene layer.

MILLER S A, DUERKSEN G L