国家/地区
IPC部 B（2）
IPC大类 B05（2）
IPC小类 B05D（2）
IPC B05D005/08（2）
发明人 LI Y（2）
公开年 2022（2）
申请年
专利权人

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Metal complex structure treated with anti-friction conduction used in aviation and aerospace field comprises metal composite structure which is used to prepare a friction-reducing conductive layer on one side surface of the metal substrate.

LI Y, WANG Y, LIU G, LI X, QIAN H, LIU J, DONG H