国家/地区 中国（2）
IPC部 B（2）
IPC大类 B05（2）
IPC小类 B05D（2）
IPC B05D007/14（2）
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Surface modified copper bus bar, has lapping surface and non-overlapping surface of copper bus are attached with silver bottom layer by magnetic control sputtering technology.

LIN Q, MEI Z

Preparing anode foil by heating and treating corroded foil, using forming solution for perform forming of corroded foil, coating graphene solution on surface of forming foil, sintering and performing phosphating treatment on forming foil.

LIU G, HUANG H, WU Q, HUO J, OU K, CHEN Y, FENG Z, YANG F