国家/地区 中国（6）
IPC部 B（6）
IPC大类 B05（6） H01（5） C01（4）
H05（4） B82（2） C23（2）
IPC小类 B05D（6）
IPC B05D005/12（3） B05D003/02（2） B05D007/00（2）
B05D007/14（2） B82Y040/00（2） C01B031/04（2）
C01B032/182（2） C01B032/184（2） H01G011/86（2）
H01L029/16（2） H01L051/00（2） H01L051/52（2）
H05K007/20（2）
发明人
公开年 2015（3） 2016（2）
申请年 2015（6）
专利权人

Preparation method of graphene conductive copper foil, involves coating mixed solution on copper foil substrate to obtain mixed solution containing graphene and binder.

LI Q

Method for depositing nano-microparticles of graphene sheets on substrate of electrode for supercondenser of e.g. car, involves performing annealing of nano-microparticles after spraying of hydrodynamic suspension with specific temperature.

BONDAVALLI P, POGNON G, GALINDO C

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Method for forming workpiece of e.g. electronic device, involves removing layer of material on top of graphene surface in predetermined pattern, and releasing graphene from catalytic film such that graphene is in form of patterned layer.

JOHNSON A T, GUDIBANDE R R, QI Z J, JOHNSON A, GUDIBANDE R, QI Z

Method for preparing graphene layer of e.g. electronic device, involves heating portion of graphene oxide layer by laser irradiation at specific laser output power, so that portion of graphene oxide is chemically reduced to graphene.

BALKENENDE A R, GIESBERS A J M, VAN DER TEMPEL L

Method for manufacturing transparent conductor in electric devices, involves removing copper support by bringing support into contact with non-acidic copper-etching solution after forming transparent resin layer to expose graphene film.

NAITO K, AKASAKA Y, YANG T, YOSHINAGA N, YANG T Y, AKITA M