国家/地区 中国（3）
IPC部 B（3）
IPC大类 B21（3） C22（2） C23（2）
H01（2）
IPC小类 B21B（3）
IPC B21B003/00（2） C22F001/08（2）
发明人
公开年 2023（2）
申请年 2022（3）
专利权人

Preparing copper-graphene composite material involves utilizing mechanical alloying method to prepare copper and polymer powder to obtain copper-polymer powder, cold isostatic pressing copper polymer powder to get bar melting region to bar porous rod material.

LIANG J, ZHANG X, WANG D, LI X, ZHOU S, GUO G, BAO F

Processing and forming liquid cooling plate involves using high heat-conducting coefficient of aluminum alloy profile, sequentially acid eluting grease, coating anti-composite material graphene heat treatment, rolling composite, and blowing.

SHI C, YANG R, ZAN Y, SHI X, RUAN R, YOU H, ZHUO N, WU Y

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H