国家/地区 中国（2）
IPC部 B（2）
IPC大类 B21（2）
IPC小类 B21B（2）
IPC B21B037/74（2）
发明人
公开年 2022（2）
申请年
专利权人

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Non-head continuous casting and rolling production method of rod and wire product involves detecting temperature of middle blank after butt joint, if temperature reaches inlet temperature requirement of continuous rolling machine set.

WANG S, YANG L, LIN B