国家/地区
IPC部 B（2）
IPC大类 B22（2）
IPC小类 B22D（2）
IPC H01L023/373（2）
发明人
公开年
申请年 2021（2）
专利权人

Metal-based composite material for use in heat sink of electronic device, has reinforcement particles comprising silicon carbide particles, diamond particles, boron carbide particles or graphene particles dispersed in metal matrix, where metal matrix has single metal matrix or alloy matrix.

WANG L, LI Q, ZHAO J

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T