国家/地区 中国（6）
IPC部 B（6）
IPC大类 B32（6） C08（4） C09（3）
E04（3） H05（2）
IPC小类 B32B（6）
IPC B32B027/30（5） B32B027/32（5） B32B027/40（4）
B32B037/06（4） B32B037/10（4） C08K003/04（4）
B32B027/20（3） B32B027/28（3） B32B033/00（3）
C08J007/06（3） C08K003/08（3） C08K009/02（3）
C08L023/06（3） C08L023/12（3） C08L027/16（3）
发明人 WANG C（6）
公开年 2021（5）
申请年 2020（6）
专利权人 CHANGCHUN AP.（3） TAIZHOU HUAL.（2）

High-strength fireproof plate comprises three-layer hot-pressing composite structure, which is fiber layer, foaming fiber layer and fiber layer, fiber layer is composed of single or multiple fiber felt after dipping thermosetting resin.

WANG C, QIAN H, CHEN J, CHENG Q, YUAN J

High-strength and fireproof panel comprises e.g. first structure which is three-layer hot-pressed composite structure comprising fiber layer and foamed fiber layer from top to bottom, and second structure which is formed by hot-pressing.

YUAN J, CHENG Q, CHEN J, QIAN H, WANG C, CHENG J

Electromagnetic shielding composite material used in 5G communication or aerospace application, comprises absorbing layer comprising modified resin layer and reflective layer having metal nanowire film layer compounded on absorbing layer.

RAN X, WANG C, FU C, NIE W, QIAN J, GAO Y, CHU H

Electromagnetic shielding composite material useful in field of 5G communication or aerospace, comprises absorption layer and reflective layer compounded on absorption layer; absorption layer includes modified resin layer.

RAN X, WANG C, FU C, NIE W, QIAN J, GAO Y, CHU H

Electromagnetic shielding composite material used in 5G communication or aerospace, comprises absorbing layer and reflecting layer compounded on absorbing layer.

RAN X, WANG C, FU C, NIE W, QIAN J, GAO Y, CHU H

Rigid polyurethane foam thermal insulation material comprises rigid polyurethane foam thermal insulation material matrix, modified material powder C, modified material powder D and modified material powder E.

LIU J, WANG Y, LIU S, WANG Z, WANG C, XUE Y, GUAN Z, ZHAO Y, JIA L, LIU Z, ZHANG L, ZHENG J, SUN H, YIN F, WEI W, CHEN J, SONG M, LI K, GU K, LI H, JIA H, DI H, DI J