国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC B32B005/02（3）
发明人 ZHANG C（3）
公开年 2021（3）
申请年 2020（2） 
专利权人

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Water-proof ventilating nonwoven fabric, has moisture-proof layer orderly paved with damp-proof inner film, moisture-proof interlayer and moisture-proof outer film, and graphene layer formed on lower surface of moisture-proof layer.

ZHANG C, CAI J

Antibacterial and comfortable high elastic textile material comprises hemp fiber, cotton fiber, chitin fiber, polyester superfine fiber, graphene fiber, guar gum hydroxypropyl trimethylammonium chloride, elastic fiber and coral velvet.

ZHAO B, YANG Y, ZHANG C