国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2） C08（2）
IPC小类 B32B（2）
IPC B32B027/32（2）
发明人 CHEN C（2）
公开年
申请年 2021（2）
专利权人

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Antistatic dust-proof polyethylene multi-layer fabric has binder which is set between base fabric and polyethylene film, where polyethylene film is hydrophilic porous polyethylene film and binder is multifunctional copolymer.

WENG X, GONG J, CHEN C, SHENG X