国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3） C08（2）
IPC小类 B32B（3）
IPC B32B037/06（3）
发明人 CHEN J（3）
公开年 2022（3）
申请年 2022（3） 
专利权人 HUIZHOU ZHON.（2）

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Producing textured composite board mobile phone cover, comprises mixing epoxy resin, allyl-containing epoxy monomer and curing agent to obtain a glue solution, coating glue on sides of modified glass fiber cloth, curing to form prepreg, placing textured film on upper surface, and hot pressing.

CHEN H, CHEN J, WANG B, HE H, ZHANG Z

Negative ion functional plate comprises upper surface layer plate, lower surface plate and core layer plate, and rubber layer capable of releasing negative ion.

YUAN C, HAO X, CHEN J, SHI L, ZHANG W, WANG H, LI Q, ZHANG J, YUAN S