国家/地区 中国（2） 美国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B043/00（2）
发明人
公开年
申请年
专利权人

Method for transferring graphene to wafer in semiconductor device for microelectronics application, involves exfoliating closest monolayer by mechanically splitting spreading layer in which closest monolayer remains on stressor layer.

BEDELL S W, DIMITRAKOPOULOS C D, FOGEL K E, HANNON J B, KIM J, PARK H, PFEIFFER D, SADANA D K, SALDANHA D K, PARK H S

Method for forming graphene pattern using exfoliation technique, involves selectively peeling graphene layer by polymer stamp, and forming raised pattern on rotator polymer stamp, where polymer stamp is made of polydimethylsiloxane.

AN K, CHUNG T, JUNG D, KIM C G, KIM H S, LEE S S, LEE Y K, AN K S, CHUNG T M, LEE S, LI Y, KIM C, KIM H