国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2） C08（2） H05（2）
IPC小类 B32B（2）
IPC B32B015/14（2）
发明人
公开年 2021（2）
申请年
专利权人

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C