国家/地区 中国（5）
IPC部 B（6） C（6）
IPC大类 B32（6） C08（6）
IPC小类 B32B（6）
IPC C08L063/00（6）
发明人 WANG L（2）
公开年 2022（6）
申请年 2021（6）
专利权人

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

High heat conducting graphene magnetic composite material comprises graphene film layer and substrate layer, where preparation raw material of graphene film layer comprises graphene, composite base material and solvent, and substrate layer comprises soft magnetic material and hard magnetic material.

LIN Y, JIANG X, CHEN F, JIANG W, FANG W

Resin composition used for forming composite material for forming fiberglass reinforced resin used for forming laminate for forming e.g. swimming pool or spa pool, comprises one or more curable resins, graphene, one or more milling media, and milled fiberglass.

BEALE L J

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Preparing coating material for electric heating and de-icing of airplane, involves obtaining reduced Graphene Oxide based on crystalline flake graphite material, and modifying epoxy resin by using Reduced Graphene Oxide.

HU Y, WEI J, WANG P, ZHANG Y

Honeycomb interlayer wave absorbing material for improving inclined incident wave absorbing performance, comprises a first skin, a wave absorbing aramid fibre honeycomb core, a wave absorbing putty and a second skin.

MENG L, HU D, WANG L, WANG Y, MING P, PENG X