国家/地区 中国（3）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC B32B007/12（3）
发明人 WANG X（3）
公开年 2021（2）
申请年
专利权人

Preparing high heat-conducting copper-clad plate useful in electronic device, comprises e.g. polishing and coarsening each plane of copper and aluminum plate, coating obtained heat conducting colloid, bonding copper plate to obtain composite plate with three-layer sandwich structure and drying.

CHE Y, FU C, WANG X

Corrugated paper board comprises surface paper and lining paper that are adhered by adhesive close to one side of corrugated paper, where adhesive comprises starch, sodium hydroxide, tannin, polyether modified organic silicone surfactant, graphene oxide, non-ionic penetrant, and water.

GUI M, WANG X, LUO Z, ZHI Y

High performance polyurethane flame retardant foam comprises a foam base layer, a bulked fiber layer and a silencing foam layer.

WANG X, YOU Z