国家/地区
IPC部 B（2） C（2） H（2）
IPC大类 B32（2） C09（2）
IPC小类 B32B（2）
IPC C09K005/14（2）
发明人
公开年 2022（2）
申请年 2021（2）
专利权人

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Wireless charging receiving end wafer module structure comprises two adjacent nano-crystal layers bonded by heat-conducting double-sided adhesive tape, nano wafer layers whose outer surface is located in uppermost layer and lowermost layer adhered with polyethylene terephthalate film.

YANG J, HU S, GU B