国家/地区
IPC部 B（2）
IPC大类 B32（2） C09（2）
IPC小类 B32B（2）
IPC C09K005/14（2）
发明人 WANG H（2）
公开年
申请年 2021（2）
专利权人

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Directional high thermal conductivity thermal interface thermal conductivity material useful for high thermal conductivity graphite-based thermal interface composite material structure, comprises graphite paper and silicone rubber.

ZHU Y, WANG H