国家/地区 美国（2）
IPC部 B（2） F（2） H（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC F28F021/02（2）
发明人
公开年
申请年
专利权人

Graphene-based thermal management core for printed wiring boards (PWB) used for electronics applications, e.g., consumer electronics, has first or second reinforcement layer which includes substrate impregnated with non-dielectric resin.

SCHNEIDER D, DAVIS W E

Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.

FAN W, LIU X, MARINER J, RAPE A