国家/地区 美国（3）
IPC部 B（3）
IPC大类 B32（3） C08（2） H01（2）
IPC小类 B32B（3）
IPC B32B015/08（3）
发明人
公开年 2022（2）
申请年 2021（3）
专利权人

Adhesion promoting layer for depositing conductive layer on inorganic or organic-inorganic hybrid substrate to form conductive structure, includes metal oxide layer containing metal oxide and chelating agent, arranged on inorganic or organic-inorganic hybrid substrate, and interface layer.

HUANG M, WANG W, CHANG Y

Multi-layered packaging film for packaging article e.g., food package comprises outer print layer comprising polymer and/or paper, graphic element, and optional first nucleating agent, inner product-side layer, and lamination layer.

CHAM P M, NARAYANSARATHY S, RODGERS B D, JOHNSON A, SAMANTA S, CHAMPAKMEONG, NARAYANSARAHSISRIDEVI, DWAYNE R B, ADAM J, SATYAVRATHA S

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R