国家/地区 中国（6） 日本（5） 美国（5） 欧洲专利局（EPO）（4） 德国（3） 韩国（3） 世界知识产权组织（3）
IPC部 B（6）
IPC大类 B32（6）
IPC小类 B32B（6）
IPC C08K007/06（6）
发明人 KIM Y S（2）
公开年 2021（4）
申请年 2020（2） 
专利权人

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

High thermal conductivity carbon fiber composite material with laminated hybrid structure comprises combination of carbon fiber cloth layer, sheet filler thermal conductivity network, and sheet sandwich ball laminated structure.

WANG H, SUN X, ZHANG J, MA C, LU N, ZENG Y, REN W, LIU C, CHENG H

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Plastic composition useful for forming product in connection structure, and coated body, comprises a polyamide resin and a graphene oxide.

SHIOZAKI R

Carbon fiber product used as material for, e.g. composite, comprises coaxial stacking morphology of truncated conical tubular graphene layers including stacked hexagonal carbon layers.

YANAGISAWA T, ENDO M, YANAGISAWA G C C