国家/地区 中国（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B037/06（2）
发明人 ZENG J（2）
公开年
申请年
专利权人

Corrosion-resistant copper clad laminate comprises substrate, heat dissipation layer which is arranged on upper and lower surfaces of substrate.

ZENG J

Manufacture of graphene superconducting aluminum substrate involves applying layer of insulating thermal adhesive on aluminum substrate, curing, providing copper foil on insulating layer, placing in vacuum hot press, and curing.

WU F, ZENG J, WEN J