国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC C08K007/06（4）
发明人 KIM Y S（2）
公开年 2021（3）
申请年
专利权人

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Carbon fiber product used as material for, e.g. composite, comprises coaxial stacking morphology of truncated conical tubular graphene layers including stacked hexagonal carbon layers.

YANAGISAWA T, ENDO M, YANAGISAWA G C C