国家/地区 中国（2）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC B32B005/02（3）
发明人
公开年 2021（3）
申请年 2021（2） 
专利权人

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Electromagnetic shielding composite coating comprises environmentally friendly epoxy resin, barium sulfate, deionized water, iron oxide red, 3-methacryloxypropyltrimethoxysilane, silver powder, graphene and rose essential oil.

LIN L, WANG M

Snow melting pavement construction of road by cutting surface of road pavement to form installation surface, winding prepared planar heating composite sheet, installing on installation surface, and repackaging ascon on composite sheet.

OK C, OCK C