国家/地区 韩国（2）
IPC部 B（3）
IPC大类 B32（3） C08（3）
IPC小类 B32B（3）
IPC B32B015/08（3）
发明人
公开年 2023（3）
申请年 2022（3） 
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Light response friction nano-generator with charge transfer limiting layer used in mechanical energy of low amplitude, has charge transfer limiting layer arranged between negative friction and electrode layer and includes nano-layer of reduced graphene oxide and silver for capturing and limiting.

HAO Y, ZHANG J, ZHAO X, WEI W, SU J, HU Z, GUO X, JIAO Y, LIN Z, MA X, CHANG J

Polyimide film used in multilayer film and flexible metal clad laminate, is obtained by imidizing polyamic acid solution containing dianhydride component including e.g. biphenyltetracarboxylic dianhydride, and diamine component including e.g. m-tolidine, and comprises graphene nanoplatelets.

JEON J, YEO M, BACK S, LEE K, CHUN J, BAEK S, LEE K N