国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4） C08（4） B65（2）
C09（2）
IPC小类 B32B（4）
IPC B32B027/32（4）
发明人 CHEN C（4）
公开年
申请年 2021（2） 
专利权人

High ductility and high temperature resistant composite food packaging film useful for food packaging or food preserving, comprises modified composite film layer which is base modified film layer, maleic anhydride graft polyethylene resin film middle layer and polyethylene outer film layer.

CHEN C

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Antistatic dust-proof polyethylene multi-layer fabric has binder which is set between base fabric and polyethylene film, where polyethylene film is hydrophilic porous polyethylene film and binder is multifunctional copolymer.

WENG X, GONG J, CHEN C, SHENG X

Packaging film comprises e.g. graphene oxide, lignin, corn starch, polybutylene succinate, polylactone, antioxidant, polyethylene, and ethylene glycol.

CHEN C