国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B015/04（2）
发明人
公开年
申请年
专利权人

Graphene heat sink comprises a heat dissipation layer and a substrate, where the substrate is provided with a first surface having two-dimensional or three-dimensional structure.

BAI D

Heat sink material has insulating layer containing silicon carbide, aluminum oxide, silica, binder, kaolin, magnesium oxide, lightweight calcium material and rare-earth oxide and thermally-conductive layer containing graphene.

YE W