国家/地区 美国（3） 韩国（2）
IPC部 B（3） C（3） H（2）
IPC大类 B82（3） C08（3） H01（2）
IPC小类 B82B（3）
IPC C08K003/04（3）
发明人
公开年 2012（3）
申请年 2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Graphene-polyurethane nanocomposite for applications such as conductive adhesive and composites for electrostatic and electromagnetic dissipation, comprises graphene, where graphene and polyurethane self-align into layers.

XIAO A Y, CAO J, LIU Y, KIM J K, ZHENG Q, ABOUTALEBI S H, GUDARZI M M, KIM J, ABOUTALEBI S, GUDARZI M, XIAO A

Graphene-polymer layered composite useful for electrodes, electric devices, and thermoelectric materials comprises at least two polymer layers, and graphene sheet formed between each of the polymer layers.

LEE E, CHOI B, YU C, LEE E K, CHOI B L, YU C H