国家/地区 日本（8）
IPC部 B（8）
IPC大类 B22（8）
IPC小类 B22F（8）
IPC B22F001/02（8）
发明人
公开年 2020（2） 2021（2）
申请年 2016（2）  2019（2）  2020（2） 
专利权人

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Composite powder useful for powder metallurgy and additive manufacturing processes, comprises particles with a core of an iron based material and a coating of a graphene based material.

JANSSON U, TIDEN S, TAHER M, DIAZ L, REMONEN T, JANSSEN U

Method for manufacturing suspension distributed in graphene group, involves adding impact repeatedly to graphene via alcohol, and separating graphene by working homogenizer apparatus so as to separate every distributed graphene to alcohol.

KOBAYASHI H

Preparing graphene metal composite material by mixing metal powder, graphene powder and binder, heating powder material to melt, molding and solidifying, removing binder from green part, and sintering brown part.

TSENG W, SHIH Y, LIN T

Making graphene-reinforced inorganic matrix composite, comprises e.g. mixing multiple particles of graphitic material and solid inorganic material, and operating apparatus for transferring graphene sheets to material particles surfaces.

ZHAMU A, JANG B Z

Composite electroconductive particles used in e.g. conductive resin, are obtained by coating conductive core particles having preset average primary particle size, with graphene.

TAMAKI E, MIYAZONO N, KUBOTA Y

Nanographitic composite for use as anode in lithium ion battery for commercial application, has graphene nanoplatelets coating portion of nanoscale particles to form layer made up of overlapping nanoplatelets.

BAMBHANIA H M, DO I, WANG H, WANG L

Graphene/metal nanocomposite powder used in nanocomposite material comprises graphenes acting as reinforcing material for base metal, where graphenes are interposed as thin film between metal particles of base metal and bonded to particles.

HONG S H, HWANG J W, LIM B K, JIN S H, HWANG J, HONG S, SEONG J, HONG C, LIM B