国家/地区 中国（2） 韩国（2） 台湾（2）
IPC部 C（6）
IPC大类 C01（6）
IPC小类 C01B（6）
IPC C01B032/182（6）
发明人 HE M（2） HUANG C（2） HUANG H（2）
JEON O N（2）
公开年 2022（3） 2023（2）
申请年 2021（6）
专利权人 CTRON ADVANC.（2） JEON O N（2）

Electromagnetic wave shielding sheet useful in covers of electrical and electronic products and interior interiors, comprises graphene powder mixed with silicon-based resin raw material, and discharged as molten fine fibers through nozzle.

JEON O N

Manufacturing electromagnetic wave shielding sheet useful in electric and electronic components e.g. heating mat, and electric blanket comprises mixing graphene powder and silicon-based resin, forming elastic fabric, and overlapping.

JEON O N

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Preparing graphene composite nano-hexagonal barium ferrite wave-absorbing material comprises mixing nano M-type barium ferrite powder with hexagonal molecular structure with glucose particles, adding water, grinding, drying, vacuuming, introducing nitrogen, and microwave heating and cooling.

ZHANG Y, ZHENG L, ZHENG P, LI R, ZHENG H

Technology for connecting heat sink and electronic device through graphene coating by mixing graphene, carbon nanotubes, nano-silicon dioxide, ion regulator, ion curing agent and pH regulator, and performing low-temperature nano-dispersion.

XUE G