国家/地区
IPC部 C（2）
IPC大类 C01（2） C09（2）
IPC小类 C01B（2）
IPC C01B032/198（2）
发明人
公开年 2022（2）
申请年 2022（2）
专利权人

Preparing thermally conductive resin used in electronic packaging, comprises e.g. uniformly mixing epoxy resin and 4-methylhexahydrophthalic anhydride, adding 2-ethyl-4-methylimidazole, continuing to uniformly mix to obtain epoxy resin mixture, and vacuumizing.

ZHU D

Manufacture of packaging film for e.g. detergent, involves applying non-solvent two-component adhesive composition to base film on which printed layer is formed, drying, laminating base film, aging and processing film into desired shape.

JEONG H R, LEE D H