国家/地区 中国（2）
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C23C014/16（2）
发明人
公开年
申请年
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Fabricating graphene to fabricate FET, comprises forming alloy catalyst layer on substrate using sputtering method and/or evaporation method, and forming graphene layer on alloy catalyst layer by supplying hydrocarbon gas onto substrate.

WOO Y, SEO D, SEO S, CHUNG H, KANG S, HEO J, SEO S A, CHUNG H J, KANG S R, HEO J S, WOO Y S, JUNG H J, HUH J S, YEO R, XU D, HUH J, JUNG H