国家/地区 中国（3） 日本（2） 美国（2）
IPC部 C（3） H（2）
IPC大类 C01（3）
IPC小类 C01B（3）
IPC C25D013/02（3）
发明人
公开年 2021（3）
申请年 2021（2） 
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Electrical interconnect component comprises connection part that is electrically conductive; and electrical contact on at least a part of a surface of connection part and comprising a graphene oxide film.

YE N, KUBO T, SHIMIZU T