国家/地区 中国（4） 美国（2）
IPC部 C（6）
IPC大类 C01（6）
IPC小类 C01B（6）
IPC F28F021/08（6）
发明人
公开年 2022（2）
申请年 2021（2） 
专利权人

Use of nitrogen-doped graphene metal material in heat-conducting field where nitrogen-doped metal graphene comprises metal base material and nitrogen-doped graphene.

WU Q, MA Y

Carbon steel material useful for heat sink in electrical and electronic devices comprise carbon steel substrate, and reduced graphene oxide coating layer formed on the carbon steel substrate.

DOW H S

Aluminium graphene uniform temperature plate for flat computer internal heat dissipation, has graphene layer arranged between aluminum-based upper plate and aluminum-based lower plate, and cross-linking holes provided with aluminum-based connecting particles.

WANG G, XU X

Forming graphene-doped aluminum composite for thermal management component i.e., avionics chassis, heat spreader, heat sink, heat exchanger, radiator, or heat pipe, by crystallizing aluminum around substantially uniformly dispersed graphene.

BLAND A, RAINBOW A J, SIDGWICK D H, SMITH M J, BRAND A, LINBO A J

Graphene thermal conductivity coating modified radiator comprises e.g. outer surface with graphite heat-conducting layer of radiating substrate connected with radiating substrate or outer surface of conducting graphene layer.

XU H, ZHOU Q

Composite material used for thermal-conducting material for thermal management of collagen, comprises metal matrix and graphene platelets dispersed in the metal matrix with random orientation.

KIM N P