国家/地区 日本（2）
IPC部 B（3）
IPC大类 B23（3）
IPC小类 C01B（3）
IPC C01B031/02（3）
发明人 FURUKAWA K（2） HIBINO H（2） IKEGAMI H（2）
TAKAMURA M（2）
公开年 2015（2）
申请年 2013（3）
专利权人 NIPPON TELEG.（2） UNIV KYUSHU（2）

Processing method for processing apparatus of graphene involves irradiating pulse laser to desired process location of graphene and removing graphene on desired location.

FURUKAWA K, TAKAMURA M, HIBINO H, IKEGAMI H

Processing apparatus for forming pattern of graphene thin film, has light source that irradiates light to process location of graphene for reflectance measurement, and measurement unit that measures reflectance of light in location.

FURUKAWA K, TAKAMURA M, HIBINO H, IKEGAMI H

Apparatus useful for exfoliation of graphene, comprises chamber having through-hole formed at its one surface, cylinder which receives graphite and volatile material, clamp disposed in chamber, and operation mechanism connected with clamp.

BAEK J B, JEON I Y