国家/地区 美国（2）
IPC部 B（2）
IPC大类 B82（2）
IPC小类 B82Y（2）
IPC B82Y030/00（2） C01B031/04（2）
发明人 ZHANG X（2）
公开年 2014（2）
申请年
专利权人

Graphene ball conductive adhesive preparation by preparing polymer microsphere using monomer mixture, performing chemical vapor deposition to grow graphene on microsphere surface, and dispersing graphene ball into epoxy resin glue system.

CHEN Y, LI J, LI Y, ZHANG X, LEE Y

Thermal interface material used to increase thermal conduction or thermal dissipation across interface comprises three-dimensional interconnected porous graphene foam structure constructed of three-dimensional interconnected graphene sheets.

YUEN M M F, ZHANG X, YEUNG K K, GAO Z, ZHANG K, ZHANG M, XU H