国家/地区
IPC部 C（2）
IPC大类 C01（2） C04（2）
IPC小类 C01B（2）
IPC C01B031/04（2）
发明人
公开年 2013（2）
申请年
专利权人

Graphene-based heat dissipation system for e.g. portable microelectronic device, has heat-conducting layer comprising sheet of integrated graphene film, which shields component or external surface of electronic device from heat.

ZHAMU A, WANG M, XIONG W, JANG B Z

Manufacture of graphene on polycrystalline silicon carbide used as bearing element in mechanical engineering, involves polishing silicon carbide components, cleaning, and graphitizing polished surface by annealing.

BENNEWITZ R, ASLAN M, WAEHLISCH C F