国家/地区
IPC部 B（2） C（2）
IPC大类 B29（2）
IPC小类 B29C（2）
IPC
发明人
公开年 2023（2）
申请年 2021（2）
专利权人

Manufacturing composite material comprises e.g. preparing foam structure using composite resin containing hexanediol diacrylate and graphene, preparing composite by filling structure with mixture and curing composite.

HOUN K J, CHOI H J

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z