国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5） H01（4）
IPC小类 C08G（5）
IPC C08G083/00（2） H01M004/60（2）
发明人
公开年 2023（5）
申请年 2023（5）
专利权人

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Graphene conductive paste premix for preparing lead-acid batteries, comprises graphene and poly(3-thiophene acrylic acid).

LI P

New vulcanized anthracene-based polymer i.e. 1,2,3,4,5,6,7,8-octasulfanyl-9,10-dihydroanthracene-9,10-dithione compound useful as active material in the anode of magnesium secondary batteries.

CHEN X, GAO P

Preparation method for supercapacitor electrode active material, involves adding graphene microflakes and sodium nitrate into three-necked flask, add concentrated sulfuric acid while stirring, continue to stir and react after adding, then add potassium permanganate to continue stirring and react.

ZHANG J, TANG Z, ZHAO C, WU Y

Conductive adhesive useful in IGBT module chip, comprises lignin-based epoxy resin, modified graphene and curing agent; lignin-based epoxy resin is obtained by polymerization of hydroxylated lignin and epoxy resin, modified graphene is obtained by treating carbon materials with coupling agent.

LIAO G, DUAN J