国家/地区 中国（7） 韩国（3） 欧洲专利局（EPO）（2） 美国（2） 世界知识产权组织（2）
IPC部 B（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08G018/32（7）
发明人
公开年 2021（2） 2022（2）
申请年 2020（2）  2021（2）  2022（2） 
专利权人

Water-blocking material for sealing openings of heat-insulating materials used for preparing structure, comprises components polysiloxane, polyether polyol isocyanate, polyolefin polyol, curing agent, catalyst, defoamer, and filler.

HU B, LIU Y, HE W, NI X, PAN Z, ZHANG S, WANG T

Selective laser sintering process for preparing highly spherical particles, involves depositing carbon nanomaterial-graft-polyurethane particles on nanomaterial surface and exposing nanomaterial grafted polyurethane particles to laser, for fusing polymer particles and forming consolidated body.

SRISKANDHA S E, FARRUGIA V M, CLARIDGE R, EMPARUZIA V, SIBANTIISWARISLISKANDA, EASWARI S, SRISKANDAR S E

Coating useful for surface of ship component i.e. pump, ship propeller and turbine blade, comprises primer (prepolymer solution, chain extender and solvent) and topcoat (graphene dispersion, topcoat prepolymer solution and/or chain extender).

SHANG Z, XU H, TIAN W, TIAN L

Preparing polyurethane thermally conductive anti-corrosion coating involves adding isophorone diisocyanate and polypropylene glycol to stirring device through feed port according to preset ratio.

CUI X, ZHANG R, MA P

Preparation of degradation immune biomimetic protective coating for steel structure engineering involves cleaning steel structure surface, applying silane coupling agent, curing, and spraying intermediate paint and top coat.

MA Y, LIU J, GE Y, ZHANG P, WU R, SONG X, XUE S, CUI Y, BAO J, XUEN M, TONG L J, GROUND O T, ZHANG F, XIAOHUI S, SHANBIN X, YIFEI C, JIUYUAN B

Preparing high-density conductive polyurethane foam, comprises e.g. adding ionic liquid 1,3-dimethylimidazole dimethyl phosphate salt and water into reactor, mixing, heating, then reacting with graphene, cooling and post-processing.

JIANG K

Resin composition for treating surface of steel sheet, comprises binder resin, graphene and solvent.

CHO J D, LEE J R, LEE J S, SHIM S E, LEE J, CHO J, SHIM S