国家/地区 中国（2）
IPC部 B（3） C（3）
IPC大类 B32（3）
IPC小类 B32B（3）
IPC C08K003/22（3）
发明人
公开年 2021（2）
申请年 2020（2） 
专利权人

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Polymeric material for two-portion composition, comprises a polymerized reaction product of a polymerizable composition comprising components, where components comprises a uretdione-containing material.

WHITE K L, YAO L, RULE J D, KRYGER M J, KROPP M A

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M