国家/地区 韩国（6） 中国（5） 欧洲专利局（EPO）（5） 美国（5） 日本（4） 加拿大（3） 世界知识产权组织（2）
IPC部 B（6） C（6）
IPC大类 B29（6）
IPC小类 C08G（6）
IPC C08L101/00（6）
发明人 EMPARUZIA V（3） FARRUGIA V M（3） SIBANTIISWARISLISKA.（3）
SRISKANDAR S E（3） SRISKANDHA S E（3） CLARIDGE R（2）
公开年 2022（3）
申请年 2021（2） 
专利权人 XEROX CORP（3）

Composition used for three-dimensional printing e.g. additive manufacturing, comprises particles comprising thermoplastic polymer grafted to carbon nanomaterial, and particles have preset aerated density.

FARRUGIA V M, SRISKANDHA S E, CLARIDGE R, SRISKANDAR S E, EMPARUZIA V, SIBANTIISWARISLISKANDA

Method for selective laser sintering for three-dimensional article, involves depositing carbon nanomaterial-graft-polyamide particles with other thermoplastic polymer particles, and exposing to laser to fuse polymer particles and form consolidated component by selective laser sintering.

SRISKANDHA S E, FARRUGIA V M, EMPARUZIA V, SIBANTIISWARISLISKANDA, SRISKANDAR S E

Selective laser sintering process for preparing highly spherical particles, involves depositing carbon nanomaterial-graft-polyurethane particles on nanomaterial surface and exposing nanomaterial grafted polyurethane particles to laser, for fusing polymer particles and forming consolidated body.

SRISKANDHA S E, FARRUGIA V M, CLARIDGE R, EMPARUZIA V, SIBANTIISWARISLISKANDA, EASWARI S, SRISKANDAR S E

Manufacturing thermoplastic resin-based thermally conductive masterbatch comprises performing in-situ polymerization by mixing thermal conductivity filler with solution containing thermoplastic resin monomer.

SOO P Y, HUHMONGYOUNG, KIM W, HAN W, KANG S B

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Manufacture of resin compound material involves uniformly dispersing carbon material having graphene structure in synthetic resin chosen from crystalline resin and non-crystalline resin under specified conditions.

SAWA K, TSUMURA K, INUI N, TAKAHASHI K, TANIGUCHI K