国家/地区 台湾（3）
IPC部 C（3） H（3）
IPC大类 C08（3） H05（3） C09（2）
H01（2）
IPC小类 C08G（3）
IPC C08K003/04（3）
发明人 JIN R（2） KIM Y S（2）
公开年 2021（2）
申请年 2021（3）
专利权人 TICONA LLC（2）

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R