国家/地区 中国（3）
IPC部 B（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K003/04（5） B32B027/06（2） B32B027/34（2）
C08K007/06（2） C08L063/00（2） H05K009/00（2）
发明人
公开年 2023（5）
申请年 2022（5）
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Preparing high electromagnetic shielding nanofiber gas gel having gradient structure, comprises e.g. mixing isopropanol, deionized water and poly(vinyl alcohol-co-ethylene) nanofiber, adding graphene oxide, silver nanowires into poly(vinyl alcohol-co-ethylene) nanofiber suspension, and freeze-drying.

WANG W, YAN K, WEN X, YANG C, WANG D

Preparation of electrothermal carbon fiber composite material based on crosslinking reinforcement by coating graphene oxide aqueous solution on surface of carbon fiber, carbon fiber yarn or carbon fiber fabric as base material, and forming composite material by vacuum-assisted resin transfer molding.

DAI M, HONG X

Foam electromagnetic shielding material with bulletproof function used in stealth airplanes, is prepared by superposing coated aramid fiber laid fabric blocks to obtain bulletproof aramid fiber chips to obtain foam electromagnetic shielding material precursor, and heating.

FU L, PAN Z, WU Z, LIU Y, FANG X, CUI Z, LI Z, XU D, AI Q, HU L, LI N, CHEN H