国家/地区
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC C08K003/04（2）
发明人
公开年 2012（2）
申请年 2012（2）
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Graphene phenolic resin conductive composite material, e.g. used for conductive material, comprises phenol, aqueous formaldehyde solution, graphite oxide, and alkaline catalyst agent.

TANG X, YU Z, ZHANG H, YAN D, YUAN F