国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08L063/02（3）
发明人 CHEN L（3）
公开年 2023（2）
申请年
专利权人

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Modifying carbon fiber supporting epoxy resin used as base material in chemical process device e.g. adding diethylenetriamine, 1-ethyl-carbodiimide hydrochloride and N-hydroxysuccinimide, mixing and stirring organic phase, and adding alkaline solution and reacting.

GUO Z, CHEN L, HE L, LIU D

Preparation of functionalized graphene oxide/epoxy resin composite material involves modifying graphene oxide by silane coupling agent, ultrasonically treating, dispersing solvent, adding epoxy resin, removing solvent, and curing.

ZHAO L, CHEN L, JIANG J, PEI Y, TANG L, WU L, WAN Y