国家/地区 中国（3） 加拿大（2） 欧洲专利局（EPO）（2） 美国（2） 世界知识产权组织（2）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC C08J005/04（5）
发明人
公开年 2022（4）
申请年 2021（5）
专利权人

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Continuous fiber bundle reinforced composite material that is used for preparing photovoltaic module backplane material, automobile shell, battery shell, rail transit equipment shell, aircraft portion, comprises strip material layer, and upper film layer and lower film layer.

WU X, CHEN H, CHENG X, HAN X, TANG K, CUI B, HU Q, WANG L, YAN S

Resin composition used for forming composite material for forming fiberglass reinforced resin used for forming laminate for forming e.g. swimming pool or spa pool, comprises one or more curable resins, graphene, one or more milling media, and milled fiberglass.

BEALE L J

Preparing coating material for electric heating and de-icing of airplane, involves obtaining reduced Graphene Oxide based on crystalline flake graphite material, and modifying epoxy resin by using Reduced Graphene Oxide.

HU Y, WEI J, WANG P, ZHANG Y

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R