国家/地区 美国（4）
IPC部 C（4）
IPC大类 C08（4） C09（4） C01（2）
H01（2） H05（2）
IPC小类 C08K（4）
IPC C09K005/14（4）
发明人
公开年 2021（4）
申请年 2020（2） 
专利权人

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Acrylic metal salt composition for resin composition, is prepared by making acrylic acid, divalent metal oxide, and thermally conductive powder in non-polar solvent, and removing solvent to obtain metal acrylate composition.

TSOU C P, CHIU K, CHEN Z, HUANG T T, HUANG T, TSOU C

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B