国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08L（3）
IPC C08K003/38（2） C08K007/00（2）
发明人 YAN C（3）
公开年 2023（3）
申请年 2022（3） 
专利权人 UNIV JIANGSU.（2）

Heat-conductive water vapor barrier coating stock solution used in solar cell, organic LED protection, electronic material encapsulation and packaging, comprises base resin, sheet filler, spherical filler, solvent, silane coupling agent and curing agent.

LI W, YAN C, SUN X, ZHAO Z

Preparation of heat-conducting material used for electronic device, by dripping mixed solution prepared using sheet-shaped heat-conducting filler and polymer material solution on saturated sodium sulfate aqueous solution for salting out, obtaining film-shaped composite material, clamping and drying.

ZHAO Z, CHEN W, YAN C

High heat-conducting ternary polymer composite material useful in e.g. integrated circuit comprises organic polymer matrix unit and filler unit dispersed and filler unit has one-dimensional nano tube/wire, on which two-dimensional nano materials are grown in situ or physically mixed.

YAN C, LI Y