国家/地区 欧洲专利局（EPO）（2）
IPC部 C（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC
发明人
公开年 2020（2）
申请年 2018（2）
专利权人

One-component thermosetting epoxy resin composition used for bonding substrates, comprises epoxy resin, hardener, and electroconductive carbon allotrope comprising conductive carbon black, graphene and/or multi-walled carbon nanotubes.

KRUEGER C

Making electroplated copper on non-metal material surface by graphene-based plating ink involves drying the ink sprayed on non-metal material surface, immersing in plating solution and applying voltage or current to get electroplated copper.

KU K, CHANG K, LAI C P