国家/地区 美国（3）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C09D（4）
IPC C09D001/00（2） C09K005/14（2）
发明人 LAI C（4）
公开年 2017（2）
申请年
专利权人 LAI C（2）

Graphene inorganic high thermal conductivity heat dissipation coating in heat exchange device, comprises graphene powder, and elemental silicon system inorganic slurry comprising nano-elementary silicon, alcohol, coupling agent and water.

LAI C

Forming electroplated copper on surface of non-metal materials by graphene-based plating ink involves preparing graphene-based plating ink, spraying plating ink on surface of non-metal material and drying ink sprayed on surface.

KU K, CHANG K, LAI C

Graphene-rich baking varnish for metal surface coating, comprises graphene nanoflakes, dispersant including non-ionic/ionic dispersant, binder made of thermoplastic polymer and carrier including aqueous liquid and organic solvent.

LAI C, CHANG K, CHEN J

Graphene baking varnish used to coat a metal surface, comprises graphene nanoflakes, heat dissipation fillers e.g. tin, dispersant i.e. nonionic or ionic dispersant, binders made of thermoplastic polymers, and carriers e.g. organic solvent.

LAI C, CHANG K, CHEN J